Product Features >Applicable size: 2-12 inch silicon, silicon carbide, sapphire and other substrate substrates >Speed selection: choose between 0-2800rpm; >Size compatibility: Connecting two specifications of products can be used directly on the same device

Product specifications:

>The surface of the cavity and carrier should be subjected to electrochemical polishing treatment without obvious scratches

>Nitrogen installation filter, with a filtration accuracy of 0.01um and a capture efficiency of 99.99%

>There is no air leakage in the solenoid valve group, drive air pipe, and door seal

>The rotating carrier needs to have positioning function

>Running a normal process program with particle values greater than or equal to 0.2um and an increase of less than 20PCS

>The fragmentation rate requirement is less than 1/10000

>The standard is to set the displacement at a speed of 2000r/min to ≤ 0.15mm.

>Rinsing, blowing, drying, and speed can be freely set, with a memory menu for optional configuration:

>Water resistance meter, industrial computer, hot nitrogen gas, heating blanket, Chinese and English, etc

Unique advantage: One chamber can hold two specifications of products simultaneously