| Equipment name | Trough wet cleaning machine |
| Equipment Description | Mainly used to remove organic matter, oxide layer, particles, and metals on the surface of wafers, the cleaning process is combined with microwave and IPA drying to achieve a good acceptance index |
| Equipment model | Cassette-type &Cassetteless-type |
| Common processes | H2SO4+H202、HF+H20、NH4OH+H202+H20、 HCL+H2O2+H20、IPA Dry |
| Wafer specifications | 2 “, 4”, 5 “, 6”, 8 “,12” wafers |
| processing capacity | 1 basket/batch, 2 baskets/batch, 25 pieces/basket |
| device body | PP/PVC |
| Process tank body | Quartz PVDF PTFE SUS316L NPP |
| Tank function | Circulation, filtration, heating, ultrasound, megasonic, throwing, drying, etc |
| Pipeline selection | PVDF PFA PP CL-PVC |
| Zhaoshengbo Optional | KAIJO/Branson |
| Selection of circulating pump | IWAKI/Pillar/Trebor/Whiteknight, etc |
| Filter selection | PALL, Entegris, and other companies in the United States |
| Valve selection | CKD/Gemu/Kitz/SMC/SEBA, etc |
| Touch screen optional | PROFACE/Mitsubishi/Siemens/OMRON |
| PLC selection | Mitsubishi/Siemens/OMRON |
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