Application range:
Compound semiconductors, power devices, MEMS, RF integrated circuits, LEDs, scientific research projects, optical devices
Equipment features:
1. Small footprint, high stability, easy operation and maintenance
2. Can be widely used in the coating and development process of silicon, silicon carbide, gallium nitride, gallium arsenide, glass and other materials
3. Can cover process requirements above 0.35um, meet the needs of 2~6-inch wafers, and can coat 3~20000CP photoresist
4. High control accuracy, real-time control solutions, Ether CAT communication, high-precision swing arm and transmission mechanism
5. Independent and controllable technical solutions, independently developed software systems, fully meet customization requirements
Main parameters:
| Main parameters | Cassette Quantity | 2&3CS |
| Wafer Type | Round wafer, Square wafer | |
| Wafer Size(mm) | 50-150mm | |
| Configuration | 2C2D\4C\4D | |
| Substrate Materials | Si、Glass、Sapphire、GaN、GaAs、Sic、LiTa03、Li3P04 | |
| Supported Lithography Processes | g-line、 i- line、 Pl |