Application range:
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MEMS
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Research projects
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Advanced packaging
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Ceramic substrates
Equipment features:
1. High-precision spray coating
2. Excellent environmental adaptability
3. Flexible adjustment of process parameters
4. Unique vacuum hot plate for enhanced stability
Main parameters:
| Main parameters | Cassette Quantity | 2 CS & 2 LP |
| Wafer Type | Round wafer, Square wafer | |
| Wafer Size(mm) | 50-300mm | |
| Atomized Particle Size | 15 μm – 40 μm | |
| Configuration | 2 spray coating units | |
| Compatible Substrate Materials | Si, Glass, Sapphire, GaN, GaAs, SiC | |
| Applicable Processes |
TSV, TGV, Bump, Frame, PCB |