Application range:
Compound semiconductors, power devices, MEMS, advanced packaging, RF integrated circuits, MircoLED, optical glass
Equipment features:
1. The cleaning machine can provide continuous and stable liquid pressure output to ensure process effect and production capacity
2. The machine configuration is flexible and can carry up to four process chambers
3. Without damaging the graphics, it provides strong megasonic energy to accelerate the impact of liquid molecules to remove pollutants in deep holes and deep grooves
4. The stability of parameter control such as liquid flow, pressure and temperature provides strong support for product consistency
5. Applicable to 12-inch and below wafers, and can be compatible with two adjacent sizes of wafers at the same time
Main parameters:
| Main parameters | Cassette Quantity | 2 CS & 2 LP |
| Wafer Type | Round wafer, Square wafer | |
| Wafer Size(mm) | 50-300mm | |
| Configuration | 4 cleaning unit | |
| Substrate Materials | Si、Glass、Sapphire、GaN、GaAs、Sic、LiTa03、Li3P04 | |
| Applicable Processes | Pre-clean / Post-clean | |
| Chemicals Used | IPA, mild acids and alkalis, DI water | |
| Drying Mode |
Spin Dry + N₂ Dry |