| Application areas:
>Applicable size: Suitable for 2-8 inch wafers >Applicable fields: RCA cleaning, pre deposition cleaning, post etching cleaning, CMP post cleaning, wet etching, EPI pre cleaning, etc >Applicable processes: particle removal, metal pollution removal, organic pollution removal, wet de gluing, pre – and post cleaning, oxide etching and removal, aluminum interconnect cleaning, copper interconnect cleaning >Configurable medication: DHF,SC1,SC2,DIO3,DICO2,IPA, Back spray configuration available for selection |
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Product advantages:
>Independent control of cleaning solution, no cross contamination
>Accurate control system for nozzle liquid flow rate
>Automatic fluid change and replenishment
>Heating control, concentration control, flow control, pressure control, over temperature protection, leakage detection, etc
>Small size, low usage cost, suitable for universities, research institutes, etc