Application range:
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Compound semiconductors
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Power devices
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MEMS
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Advanced packaging
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RF integrated circuits
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MicroOLED
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Optical glass
Equipment features:
1. Four-arm handling system ensures dry-in/wet-out processing to prevent contamination
2. Combines tank soaking with single-wafer spin spray for higher process yield
3. Resist stripper recycling and filtration system reduces operational cost
4. Optional advanced megasonic and ultrasonic cleaning modules for demanding processes
5. Precious metal recovery functionality
Main parameters:
| Main parameters | Cassette Quantity | 2 CS / 2 LP |
| Wafer Type | Round wafer, Square wafer | |
| Wafer Size(mm) | 50–300 mm | |
| Configuration | 1 Soak + 1 Stripper + 1 Cleaning unit | |
| Substrate Materials | Si, Glass, Sapphire, GaN, GaAs, SiC | |
| Applicable Processes | Lift-off, Resist stripping | |
| Nozzles | High-pressure jet nozzles (cylindrical and fan type) |