Application range:
-
Advanced packaging
-
MOSFET / IGBT
-
MEMS
-
RF integrated circuits
-
Optical components
-
Research projects
Equipment features:
1. High-capacity stacked architecture with excellent space efficiency
2. Modular core units for flexible configuration and maximum customization
3. Multi-chamber shared resist supply system to minimize photoresist usage
4. Optional integration with high-precision hotplates, WEE, AOI units
5. Compatible with major lithography tools for full fab automation
Main parameters:
| Main parameters | Cassette Quantity | 4 LP |
| Wafer Type | Round wafers | |
| Wafer Size(mm) | 150 mm / 200 mm / 300 mm | |
| Configuration Options | 4C4D / 8C / 8D | |
| Compatible Substrate Materials | Si、Glass | |
| Applicable Lithography Processes | Immersion, SOC, KrF, ArF, i-line, PI | |
| Inline Capability | Compatible with ASML / CANON / NIKON / SMEE |