Application range:
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Compound semiconductors
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Power devices
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MEMS
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RF integrated circuits
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Advanced packaging
Equipment features:
1. Multi-layered architecture for high space efficiency and minimal footprint
2. Layered reaction chamber design supporting multiple chemical spray types
3. Chemical recycling system with filtration to reduce operating cost
4. Real-time control of flow rate, temperature, pressure, concentration, and spray mode for optimized etch uniformity
Main parameters:
| Main parameters | Cassette Quantity | 2 CS & 2 LP |
| Wafer Type | Round wafer | |
| Wafer Size(mm) | 50-300mm | |
| Configuration | 4 etching units | |
| Etchable Materials | Cu, Ti, Ni, Al, Au, SiO₂, Si | |
| Process Type | Wet etching | |
| Chemical Solutions |
H₂O₂, H₂SO₄, HF, HNO₃, H₃PO₄, HCl |