Application range:
Compound semiconductors, power devices, MEMS, RF integrated circuits, LEDs, optical devices, scientific research projects
Equipment features:
1. Small footprint, high stability, easy operation and maintenance
2. Easy to operate, user-friendly interface
3. Suitable for scientific research projects, small batch production in laboratories
Main parameters:
| Main parameters | Cassette Quantity | 2&3CS |
| Wafer Type | Round wafer, Square wafer | |
| Wafer Size(mm) | 50-200mm | |
| Configuration | 1C1D\2C\2D | |
| Substrate Materials | Si、Glass、Sapphire、GaN、GaAs、Sic、LiTa03、Li3P04 | |
| Supported Lithography Processes | g-line、 i- line、 Pl |