Application range:
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Compound semiconductors
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Power devices
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MEMS
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RF integrated circuits
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LEDs
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Optical glass
Equipment features:
1. Full compatibility with 2–12 inch wafers
2. Excellent coating uniformity with low defect rate
3. Stable handling of slightly warped wafers
4. Secure heating and vacuum adsorption for warped wafers
5. Real-time wafer position calibration
Main parameters:
| Main parameters | Cassette Quantity | 2 CS / 3 CS |
| Wafer Type | Round wafers | |
| Wafer Size(mm) | 25–300 mm | |
| Configuration Options | 2C2D / 4C / 4D | |
| Compatible Substrate Materials | Si, Glass, Sapphire, GaN, GaAs, SiC | |
| Applicable Lithography Processes | g-line, i-line, Pl |