For cleaning “glass substrates” and “7-inch photomasks,” different equipment technologies vary significantly in their focus. The core emphasis lies in achieving non-destructive, efficient, and ultra-clean cleaning of precision patterns and optical surfaces.

To help you quickly distinguish between them, the key characteristics of major cleaning technologies are as follows:

Precision Wet Chemical Cleaning (Photomask-Specific)

· Applicable Substrates: Photomasks (7-inch, etc.), high-value substrates

· Key Features: Customized chemical cleaning processes targeting photoresist, organic contaminants, and particulate contamination. Includes multi-channel waste liquid separation, precise supply and heating of various chemicals (e.g., sulfuric acid, hydrogen peroxide, ammonia), ultrasonic assistance, and high-purity water rinsing/drying.

· Typical Applications: Photomask cleaning and regeneration in semiconductor manufacturing and micro/nano fabrication centers.

Fully Automated In-line Cleaning (Glass Substrates)

· Applicable Substrates: Glass substrates (G2.5–G6 generation lines), display panels

· Key Features: In-line, high-efficiency batch processing. Integrated cleaning, rinsing, and drying workflow effectively removes microparticles, organic contaminants, and metallic impurities.

· Typical Applications: Pre-coating and post-edge-polishing cleaning in panel and substrate manufacturing.

Ultrasonic Cleaning

· Applicable Objects: Glass substrates, optical lenses, general components

· Key Features: Physically dislodges contaminants via cavitation effect with broad applicability. Multi-tank design often paired with hot-air drying.

· Typical Applications: Cleaning before/after coating for ITO glass, LCD substrates, and optical products.

Ultraviolet/Ozone (UV-O₃) Cleaning

· Applicable Objects: Cleaning organic contaminants from surfaces like glass, silicon wafers, ceramics

· Key Features: Dry cleaning method requiring no chemicals. UV light decomposes organic matter, while ozone oxidation removes residues, achieving surface modification (e.g., enhancing hydrophilicity).

· Typical Applications: Substrate cleaning before coating, removal of surface organic contaminants.

Two-Fluid/High-Pressure Spray Cleaning

· Applicable Targets: Post-cut wafers, glass, substrates

· Key Features: Utilizes fine atomized droplets to generate significant impact force, effectively cleaning microscopic dust within cut grooves.

· Typical Applications: Cleaning of materials like wafers, glass, and ceramics after cutting.

🎯 Key Considerations for 7-inch Mask Cleaning

If your focus is 7-inch mask cleaning—one of the most stringent cleanliness-demanding fields—equipment must meet these requirements:

1. Precision Cleanliness Assurance: Equipment must possess sub-micron particle removal capability (e.g., 1μm and above). Systems at Tsinghua University’s Micro/Nano Fabrication Center integrate ultrasonic cleaning, acid spray rinsing, and multi-channel waste liquid separation (acid, water, alkali) to ensure complete removal of residual photoresist, particles, and other contaminants.

2. Efficient Resist and Organic Material Removal: Capable of effectively eliminating photoresist and its residues. High-end equipment features multiple chemical storage tanks (e.g., sulfuric acid, hydrogen peroxide, ammonia) with precise temperature and flow control.

3. Safe, Non-Damaging Drying Technology: Advanced drying techniques are crucial to prevent damage to intricate patterns. For instance, “hot purified water drying” replaces traditional air knives, eliminating adjustment hassles and contamination risks from water droplets and splashes.

4. Operational Automation and Safety: Fully automated equipment dominates to meet frequent cleaning demands. These systems handle the entire process from cleaning to drying autonomously, supporting batch loading via dedicated cassettes (e.g., up to 20 wafers at once). Additionally, equipment must incorporate comprehensive safety interlocks and waste liquid management systems.

💎 Selection and Communication Guidelines

When selecting equipment, base your decisions and discussions on the following points:

· Define Core Processes: First identify the primary contaminants—particles, organic matter, or photoresist. Mask cleaning typically requires wet chemical combinations, while glass substrate cleaning may prioritize particle removal.

· Focus on Critical Modules: For masks, verify precise chemical supply and temperature control systems, ultrasonic modules, and safe, non-damaging drying units.

· Evaluate scalability and support: Determine if the equipment supports storing and recalling process recipes, and whether it offers process development assistance for specific contamination challenges.

If you could provide more specific details about the cleaning targets (e.g., whether they are chromium masks for semiconductor lithography or glass masks for the panel industry) and the primary contamination types, I could offer more tailored analysis.